a) PCB Loader Model: ALD-23 CEU, YJ Link
b) PCB Un Loader Model:AUD-23 CEU, YJ Link
   LED tower light with buzzer
   Dual clamping for Magazine warp prevention
   Vertical alignment of Magazine conveyor
   Emergency switch
   SMEMA Cable
   Double plate structure
   Magazine rack 50 slots and for PCB size 510 mm X 510 mm (U Size)
   Magazine exchange time : 28 sec
   Bottom to Top magazine flow
   CE certified
   PCB size 510 mm × 510 mm (U size)
   1000 mm working length
   Double plate structure
   CE certified
   Pass/work mode inspection function
   Conveyor speed controller option
   Touch screen
Model: SERIO 4000, EKRA
   Economical in-line system with closed loop print head & Stencil underside cleaning
   EKRA Vision Alignment system
   Quick Exchange Squeegee system
   Dynamic Scalability
   Simplex User Interface & Touch Screen function
   Suitable for stencils up to 31"
   Customized for individual needs
   Print format up to 610 mm X 510 mm
   Program changeover time less than 2 minutes
   EMS Manufacturing for high volume/ high mix applications
Model: KY8030 2L, Koh Young
   The KY-8030 is an in-line fully automated SPI system
   Shadow-free inspection technology and software to deliver 100% 3D inspection of solder paste
   Inspects solder paste Volume, Area, Height, Offset, Bridging, Shape Deformity
   Highest accuracy and repeatability
   Shortest programming time
   Easy UI & SPC Plus included to help printing process optimization
   Accurate, powerful SPC tool package
   Guarantees correct solder joint volume per IPC 610 requirements
   No PCB color sensitivity
   Solder paste printing optimization-at its best
Model: NXT III, Fuji
Latest Generation, Advanced pick and place machine (NXT III), Multi component Mounter (XPF-W), rated capacity of 104,000 CPH, and completely configurable as per production requirement with different placement heads in NXTIII, with a feeder capacity of over 285 nos of 8 mm slots & tray unit to handle any complex type board. Machine has the capacity to place the smallest component available (03015) up to BGA, Micro BGA, CSP etc.
   High speed Multi function modular placing Machine
   Improved productivity achieves Rated Capacity of 63,500 cph (Chips per hour)
   0201 mm part support
   Improved usability
   Improved compatibility
   Supports Glue application process
   Supports for panel up to 610 mm × 534 mm
   High Speed multipurpose mounter
   Rated Capacity of 49,600 CPH (0.145 sec/ component)
   Placing heads are exchanged automatically during production
   High Speed and multipurpose needs at the same time
   Support for panels up to 686 mm X 508 mm
Model: FX-12-220, Nordson Yestech
   Inline 5 Mega Pixel Automated Optical System with 12 micron High Magnification
   Quick set-up
   High speed
   PCB Handling size 22" X 20"
   High defect Coverage
   Low false failure rate
   Automated inspection for Solder defects, lead defects, component presence and position, correct
     part number and polarity, through hole parts and paste
   Minimum component size 0201 to 01005 with high magnification option
   Color, OCV, OCR, bar code recognition, both image and rule based algorithms
Model: SOITEC XPM 3M 1240N (Vitronics)
   12 heating zones and 4 cooling zones
   Autoset Profile /receipe generator
   350º C maximum setpoint temperature
   Flux Flow Control flux evacuation system
   Patented Individual Cell Inlet and Exhaust enables optimized gas flow management
   Active forced convection and bottom cooling cells
   Easy to maintain cooling zones
Model: XTV 160 (Nikon)
Stand alone x-ray machine is used for the inspection of hidden defects which cannot be captured by human eyes or by AOIS. This machine is used to identify the defects in BGA, Micro BGA , CSPs, POP , QFPs, etc.
   Versatile Xray System for both production manufacture and failure analysis interrogation.
   Cost Effective X-ray Inspection System to cope with the demands of ever-smaller electrical
     components.
   Complies DIN 54113 Radiation safety Standards and CE Regulation
   Inside view of PCBs or electrical components in a smooth non-destructive process
   Easy to use
   Programmable Control System
   Inspection at the Highest levels of magnification
   Compact design
   High resolution Imaging
   Low throughput life cost
Model: IR-E6Vi 300 Evolution, PDR
   Focused IR component heating
   Quartz IR PCB preheater large area (520 mm X 320 mm) 3000W system
   Advanced Precision component pick and placement
   Component nest / flux application facility
   Precision X/Y/Theta PCB Table
   Auto -profile process control package
   BGA Alignment
   Optional Auxiliary Process Camera
   Real time measurement of component temperatures
   Precision PCB Temperature sensing
Model: Martin 10.6-HXV (Martin)
   Flexible- Patented Hybrid Technology. Various successfully tested tools of small QFNs to larger
     processor sockets.
   Uses Auto Vision Technology
   Equipment for residual solder removal and dispensing functions
   High resolution CMOS 5 Mega Pixel camera
   Hybrid underheater with IR and Convection
   Board warping is avoided
   Precision hot air technology
   Guarantees best soldering results
   Placement nozzle with automatic 4- Axes Control
   Efficient and faster
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Last Updated 22nd November 2024